1. Ta yaya SMT solder manna rinjayar soldering ingancin?
Matsakaicin yawan juzu'i da abun da ke tattare da abubuwan haɗin gwal na manna:
(1) Abubuwan da ke ƙirƙirar fim: 2% ~ 5%, galibi rosin, da abubuwan da aka samo asali, kayan roba, waɗanda aka fi amfani da su shine rosin ruwa-fari.
(2) Mai kunnawa: 0.05% ~ 0.5%, masu kunnawa da aka fi amfani da su sun haɗa da acid dicarboxylic, acid carboxylic na musamman, da gishirin halide na halitta.
(3) Thixotropic wakili: 0.2% ~ 2%, yana ƙaruwa danko kuma yana aiki azaman dakatarwa.Akwai irin waɗannan abubuwa da yawa, zai fi dacewa man kasko, man kasko mai hydrogenated, ethylene glycol mono butylene, da carboxymethyl cellulose.
(4) Magani: 3% ~ 7%, Multi-bangaren, tare da daban-daban tafasa maki.
(5) Wasu: surfactants, coupling agents.
Tasirin abun da ke ciki na solder manna juyi akan ingancin siyarwar:
Tin bead splash, flux splash, ball book array (BGA) fanko, bridging, da sauran matalauta guntu SMT da walda suna da kyakkyawar dangantaka tare da abun da ke ciki na manna solder.Ya kamata a zaɓi zaɓin manna mai siyar bisa ga halaye na tsari na taron hukumar da'ira (PCBA).Matsakaicin solder foda yana da babban tasiri akan inganta aikin slump da danko.Mafi girman abun ciki na solder foda, ƙarami da slump.Saboda haka, solder manna amfani ga lafiya-fiti aka gyara ya kamata a yi amfani da 88% ~ 92% karin solder foda abun ciki na solder manna.
1. The activator kayyade solderability ko wettability na solder manna.Don cimma kyakkyawar siyarwar, dole ne a sami mai kunnawa da ya dace a cikin manna, musamman a yanayin siyar da kayan kwalliyar micro-pad, idan aikin bai isa ba, yana iya haifar da yanayin ƙwallon inabi da lahani na ƙwallon ƙwallon ƙafa.
2. Abubuwan da ke samar da fina-finai suna shafar ma'auni na haɗin gwiwa na solder da danko da danko na manna solder.
3. Flux ne yafi amfani da su narke activators, film-forming abubuwa, thixotropic jamiái, da dai sauransu A juyi a solder manna ne kullum hada da kaushi da daban-daban tafasasshen maki.Manufar yin amfani da manyan abubuwan kaushi mai tafasa shine don hana solder da juzu'i daga fantsama yayin siyarwar sake kwarara.
4. Ana amfani da wakili na Thixotropic don inganta aikin bugu da aikin aiwatarwa.
2. Menene abubuwan da suka shafi ingancin samar da SMT?
Zagayowar jeri yana nufin lokacin da ake ɗaukar shugaban jeri na kayan aiki don fara kirgawa lokacin da Feeder ya ɗauki abubuwan da aka gyara, bayan gano hoto na abubuwan da aka gyara, cantilever yana motsawa zuwa matsayi daidai, axis na aiki yana sanya abubuwan da aka gyara a cikin allon PCB. , sannan ya koma wurin ciyarwar Feeder.Yana da zagayowar jeri;lokacin da aka yi amfani da shi a cikin zagayowar jeri kuma shine mafi mahimmancin ƙimar sigina wanda ke shafar saurin injin jeri.Tsarin jeri na injunan jeri cantilever masu sauri don hawa juriya-abubuwan iya aiki gabaɗaya a cikin 1.0s.A halin yanzu, wurin SMT Zagayowar mafi girman mai hawan cantilever a cikin masana'antar sarrafa guntu shine kusan 0.5s;zagayowar hawa manyan ICs, BGAs, haši, da aluminum electrolytic capacitors ne game da 2s.
Abubuwan da ke shafar zagayowar jeri:
Adadin daidaitawa na ɗaukar abubuwan haɗin gwiwa (wato, sandunan haɗin kai da yawa na kan jeri sama da faɗuwa a lokaci guda don ɗaukar abubuwan haɗin gwiwa).
Girman allon PCB (mafi girman allon PCB, mafi girman kewayon motsi na X/Y na shugaban sanyawa, kuma mafi tsayin lokacin aiki).
Adadin jifa sashi (idan ba a saita sigogin hoton da kyau ba, jifar kayan aiki da ayyukan X/Y mara inganci zasu faru yayin aikin tantance hoto na ɗaukar abubuwan haɗin gwiwa).
Na'urar tana saita ƙimar ma'aunin saurin motsi X/Y/Z/R.
3. Yadda za a adana da kuma amfani da manna solder yadda ya kamata a cikin masana'antar sarrafa facin SMT?
1. Lokacin da ba'a yi amfani da man na'ura ba, ya kamata a adana shi a cikin firiji, kuma yawan zafin jiki ya kasance a cikin kewayon 3 ~ 7 ° C.Lura cewa ba za a iya daskarar da manna mai a ƙasa 0°C ba.
2. Ya kamata a sami ma'aunin zafi da sanyio a cikin firiji don gano yanayin da aka adana kowane sa'o'i 12 kuma yin rikodin.Ana buƙatar duba ma'aunin zafin jiki akai-akai don hana gazawar, kuma yakamata a yi bayanan da suka dace.
3. Lokacin siyan manna mai siyarwa, ya zama dole don liƙa ranar siyan don bambanta batches daban-daban.Dangane da odar sarrafa guntu ta SMT, wajibi ne a sarrafa tsarin amfani da manna mai siyar, kuma ana sarrafa kayan gabaɗaya cikin kwanaki 30.
4. Ya kamata a adana ma'ajiyar solder manna daban bisa ga nau'ikan iri daban-daban, lambobin batch, da masana'antun daban-daban.Bayan siyan siyar da manna, ya kamata a adana shi a cikin firiji, kuma a bi ka'idar farko-farko, fitowar farko.
4. Menene dalilan sanyi waldi a PCBA aiki
1. The reflow zafin jiki ne ma low ko zama lokaci a reflow soldering zafin jiki ne ma gajere, sakamakon rashin isasshen zafi a lokacin reflow da rashin cika narke na karfe foda.
2. A cikin yanayin sanyaya, iska mai sanyi mai ƙarfi, ko motsi na bel ɗin da ba daidai ba yana damun haɗin gwiwar solder, kuma yana gabatar da sifofi marasa daidaituwa a saman haɗin ginin, musamman ma a yanayin zafi kaɗan kaɗan fiye da wurin narkewa, lokacin da solder yayi laushi sosai.
3. Lalacewar ƙasa a kusa da pads ko jagororin na iya hana juzu'i, yana haifar da sake fitowar da bai cika ba.Wani lokaci foda wanda ba a narkewa ba za a iya lura da shi a saman haɗin haɗin siyar.A lokaci guda, rashin isassun ƙarfin juyi zai kuma haifar da rashin cikawar cirewar oxides na ƙarfe da rashin cikawa na gaba.
4. ingancin solder karfe foda ba shi da kyau;Yawancin su suna samuwa ne ta hanyar ɓoye ƙwayoyin foda mai oxidized sosai.
5. Yadda Ake Tsabtace Majalisar PCB A Hanya Mafi Aminci Da Ingantacciyar Hanya
Tsaftace majalissar PCB yakamata yayi amfani da mafi dacewa mai tsafta da tsaftataccen ƙarfi, wanda ya dogara da buƙatun hukumar.Anan, an kwatanta hanyoyin tsaftace PCB daban-daban da ribobi da fursunoni.
1. Ultrasonic PCB Cleaning
Mai tsabtace PCB na ultrasonic yana tsaftace PCBs mara kyau da sauri ba tare da tsaftacewa ba, kuma wannan ita ce hanyar tsaftace PCB mafi tattalin arziki.Bayan haka, wannan hanyar tsaftacewa ba ta iyakance girman PCB ko yawa ba.Koyaya, ba zai iya tsaftace taron PCB ba saboda ultrasonic na iya cutar da abubuwan lantarki da taron.Hakanan ba zai iya tsaftace sararin samaniya/tsarin PCB ba saboda ultrasonic na iya shafar madaidaicin lantarki na hukumar.
2. Cikakken Tsabtace Kan Layi na PCBA ta atomatik
Cikakken mai tsabtace PCBA ta kan layi ta atomatik ya dace don tsaftace babban kundin taron PCB.Dukansu PCB da PCBA za a iya tsabtace su, kuma ba zai shafi ainihin allon allon ba.PCBAs sun wuce ramuka daban-daban masu cike da ƙarfi don kammala ayyukan tsabtace tushen ruwan sinadarai, kurkurewar ruwa, bushewa, da sauransu.Wannan PCBA tsaftacewa hanya na bukatar sauran ƙarfi zama jituwa tare da aka gyara, PCB surface, solder mask, da dai sauransu Kuma mu ma dole kula da musamman aka gyara a hali da cewa su ba za a iya wanke.Ana iya tsaftace sararin samaniya da PCB na likitanci ta wannan hanyar.
3. Half Atomatik PCBA Cleaning
Ba kamar mai tsabtace PCBA na kan layi ba, ana iya ɗaukar mai tsabtace rabin atomatik da hannu a kowane wuri na layin taron, kuma yana da rami ɗaya kawai.Ko da yake tsarin tsaftacewa iri ɗaya ne da tsaftacewar PCBA ta kan layi, duk hanyoyin suna faruwa a cikin rami ɗaya.PCBAs suna buƙatar gyarawa ta wurin gyarawa ko sanya su cikin kwando, kuma adadinsu yana da iyaka.
4. Manual PCBA Cleaning
Mai tsabtace PCBA na hannu ya dace da ƙaramin tsari na PCBA wanda ke buƙatar ƙauyen tsaftacewa na MPC.PCBA tana kammala tsabtace tushen ruwan sinadari a cikin wankan zafi akai-akai.
Mun zaɓi hanyar tsaftace PCBA mafi dacewa dangane da buƙatun PCBA.