1. Ko SMT solder paste inokanganisa sei soldering quality?
Iyo flux mass ratio uye kuumbwa kwe solder paste flux zvikamu:
(1) Mafirimu ekugadzira zvinhu: 2% ~ 5%, kunyanya rosin, uye zvinobva, zvigadzirwa zvekugadzira, zvinonyanya kushandiswa imvura-chena rosin.
(2) Activator: 0.05% ~ 0.5%, inonyanya kushandiswa activator inosanganisira dicarboxylic acids, yakakosha carboxylic acids, uye organic halide munyu.
(3) Thixotropic agent: 0.2% ~ 2%, inowedzera viscosity uye inoita sekumiswa.Kune zvinhu zvakawanda zvakadai, kunyanya mafuta emafuta, hydrogenated castor oil, ethylene glycol mono butylene, uye carboxymethyl cellulose.
(4) Solvent: 3% ~ 7%, yakawanda-chikamu, ine zvakasiyana-siyana zvekubikira.
(5) Vamwe: surfactants, coupling agents.
Kupesvedzera kwe solder paste flux kuumbwa pane soldering mhando:
Tin bead splash, flux splash, ball book array (BGA) void, bridging, uye humwe hurombo hweSMT chip processing uye welding zvine hukama hukuru nekuumbwa kwesolder paste.Kusarudzwa kwe solder paste kunofanirwa kusarudzwa zvichienderana nemaitiro eiyo yakadhindwa redunhu board assembly (PCBA).Chikamu che solder powder chine simba guru pakuvandudza slump performance uye viscosity.Iyo yakakwirira iyo solder powder content, idiki iyo inodonha.Saka, iyo solder paste inoshandiswa kune yakanaka-pitch components inofanira kushandisa 88% ~ 92% yakawanda solder poda inogadzirwa ne solder paste.
1. The activator inosarudza solderability kana wettability ye solder paste.Kuti uwane zvakanaka soldering, panofanira kunge kune activator yakakodzera mune solder paste, kunyanya munyaya ye micro-pad soldering, kana basa racho risina kukwana, rinogona kukonzera bhora remazambiringa chiitiko uye bhora-socket defects.
2. Zvinhu zvinogadzira firimu zvinokanganisa kuyerwa kwemajoini ekutengesa uye viscosity uye viscosity ye solder paste.
3. Flux inonyanya kushandiswa kunyungudutsa activators, film-forming substances, thixotropic agents, etc. Iyo flux in solder paste inowanzo umbwa nezvinonyungudutsa zvine mapoinzi akasiyana ekuvira.Chinangwa chekushandisa yakakwira yekubikira poindi zvinonyungudutsa ndeyekudzivirira solder uye flux kubva pakupfapfaidza panguva yekuyerera solder.
4. Thixotropic agent inoshandiswa pakuvandudza kushanda kwekudhinda nekugadzirisa kushanda.
2. Ndezvipi zvinhu zvinokanganisa kushanda kwekugadzirwa kweSMT?
Kutenderera kwekuisa kunoreva nguva inotora kuti musoro wekuisa midziyo utange kuverenga apo Mudyisi anotora zvikamu, mushure mekuona mufananidzo wezvikamu, cantilever inofamba ichienda kunzvimbo inoenderana, axis inoshanda inoisa zvikamu muPCB board. , wozodzokera kuFeeder feeding position.Iro denderedzwa rekuisa;iyo nguva inoshandiswa mukutenderera kwekuisa zvakare ndiyo yakakosha parameter kukosha inokanganisa kumhanya kwemuchina wekuisa.Iyo yekumisikidza kutenderera kweyakakwira-kumhanya cantilever yekuisa mashini ekumisikidza kupikisa-capacitance zvikamu kazhinji mukati me1.0s.Parizvino, kuiswa kweSMT Kutenderera kwepamusoro-soro cantilever mounter mu chip processing industry inenge 0.5s;kutenderera kwekukwira maICs makuru, BGAs, majoini, uye aluminium electrolytic capacitors inenge 2s.
Zvinhu zvinokanganisa kutenderera kwekuiswa:
Huwandu hwekuyananisa hwekunhonga zvinhu (kureva kuti, matanda akawanda ekubatanidza emusoro wekuiswa anosimuka nekudonha panguva imwe chete kuti atore zvikamu).
PCB bhodhi saizi (yakakura iyo PCB board, yakakura iyo X/Y mafambiro emhando yekuisa musoro, uye iyo yakareba nguva yekushanda).
Chikamu chekukanda mwero (kana chikamu chemufananidzo ma parameter asina kuiswa zvakanaka, kukanda midziyo uye kusashanda X / Y zviito zvichaitika panguva yekuzivikanwa kwechifananidzo nzira yekutora zvikamu).
Chishandiso chinoseta iyo inofamba yekumhanyisa parameter kukosha X/Y/Z/R.
3. Nzira yekuchengetedza zvinobudirira uye kushandisa solder paste mune SMT chigamba processing fekitari?
1. Kana iyo solder paste isingashandisi, inofanira kuchengetwa mufiriji, uye kupisa kwayo kwekuchengetedza kunofanira kunge kuri mukati me3 ~ 7 ° C.Ndapota cherechedza kuti solder paste haigoni kuomeswa nechando pasi pe 0°C.
2. Panofanira kuva ne thermometer yakatsaurirwa mufiriji kuti ione tembiricha yakachengetwa maawa gumi nemaviri oga oga uye kuita rekodhi.Iyo thermometer inoda kuongororwa nguva nenguva kudzivirira kutadza, uye marekodhi akakodzera anofanirwa kuitwa.
3. Paunenge uchitenga solder paste, zvakakosha kuisa zuva rekutenga kusiyanisa mabheti akasiyana.Zvinoenderana neiyo SMT chip processing order, zvinodikanwa kudzora kutenderera kwekushandisa solder paste, uye hesiti inowanzodzorwa mukati memazuva makumi matatu.
4. Solder paste storage inofanira kuchengetwa zvakasiyana maererano nemhando dzakasiyana, nhamba dzebatch, uye vagadziri vakasiyana.Mushure mekutenga solder paste, inofanira kuchengetwa mufiriji, uye nheyo yekutanga-mukati, yekutanga-kunze inofanira kuteverwa.
4. Ndezvipi zvikonzero zvekutonhora kwekutsvaira muPCBA processing
1. Iyo tembiricha yekuyerera yakaderera zvakanyanya kana nguva yekugara panguva yekuyerera solder tembiricha ipfupi, zvichikonzera kusakwana kwekupisa panguva yekuyerera uye kunyungudika kusina kukwana kwehupfu hwesimbi.
2. Muchikamu chekutonhodza, mhepo yakasimba yekutonhodza, kana kufamba kwebhandi rekutakura risina kuenzana rinokanganisa majoini anotengeswa, uye rinopa zvimiro zvisina kuenzana pamusoro pemajoini anotengeswa, kunyanya pakupisa zvishoma kudarika nzvimbo inonyunguduka, apo solder yakapfava kwazvo.
3. Kusvibiswa kwepamusoro pamapadhi uye kumativi epamapedhi kana madhairekitori anogona kutadzisa kuyerera, zvichikonzera kuyerera kusina kukwana.Dzimwe nguva unmelted solder powder inogona kuonekwa pamusoro peiyo solder joint.Panguva imwecheteyo, kusakwana kwekuyerera kwesimba kunozokonzerawo kusakwana kubviswa kwesimbi oxides uye inozotevera isina kukwana condensation.
4. Hunhu hwehupfu hwesimbi husina kunaka;mazhinji acho anoumbwa ne encapsulation ye yakanyanya oxidized poda particles.
5. Nzira yeKuchenesa PCB Gungano nenzira Yakachengeteka uye Yakanyanya Kubudirira
Kuchenesa PCB magungano anofanira kushandisa yakanyatsokodzera kuchenesa uye kuchenesa solvent, zvinoenderana nebhodhi zvinodiwa.Pano, nzira dzakasiyana dzekuchenesa PCB uye zvayakanakira nezvayakaipira zvinoratidzwa.
1. Ultrasonic PCB Kuchenesa
Iyo ultrasonic PCB yekuchenesa inosuka isina maPCB nekukurumidza pasina kuchenesa solvent, uye iyi ndiyo yakanyanya hupfumi PCB yekuchenesa nzira.Kunze kwezvo, iyi nzira yekuchenesa haitenderi saizi yePCB kana huwandu.Nekudaro, haigone kuchenesa PCB gungano nekuti ultrasonic inogona kukuvadza zvemagetsi zvikamu uye gungano.Iyo zvakare haigone kuchenesa aerospace / kudzivirira PCB nekuti iyo ultrasonic inogona kukanganisa kurongeka kwemagetsi ebhodhi.
2. Yakazara Automatic On-Line PCBA Kuchenesa
Iyo yakazara otomatiki pa-line PCBA yekuchenesa yakakodzera kuchenesa mavhoriyamu makuru ePCB gungano.Ose ari maviri PCB nePCBA anogona kucheneswa, uye hazvizokanganise mabhodhi 'chaizvo.Iwo maPCBA anopfuudza akasiyana-akazadzwa-akazadzwa makomba kuti apedze maitiro emakemikari emvura-based kuchenesa, mvura-based rinsing, kuomesa, zvichingodaro.Iyi PCBA yekuchenesa nzira inoda kuti solvent ienderane nezvikamu, PCB pamusoro, solder mask, etc. Uye isu tinofanirawo kubhadhara kune zvakakosha zvikamu kana zvisingakwanisi kushambidzwa.Aerospace uye yekurapa-giredhi PCB inogona kucheneswa nenzira iyi.
3. Half Automatic PCBA Cleaning
Kusiyana neyepamhepo PCBA yekuchenesa, iyo hafu-otomatiki yekuchenesa inogona kutakurwa nemaoko panzvimbo ipi neipi yemutsetse wegungano, uye inongova negomba rimwe chete.Kunyangwe maitiro ayo ekuchenesa akafanana neyepamhepo PCBA yekuchenesa, maitiro ese anoitika mugomba rimwe chete.Iwo maPCBA anofanirwa kugadzirwa neyakagadziriswa kana kuiswa mudengu, uye huwandu hwavo hushoma.
4. Chinyorwa PCBA Kuchenesa
Iyo PCBA yekuchenesa yemanyorero inokodzera diki-batch PCBA inoda iyo MPC yekuchenesa solvent.Iyo PCBA inopedzisa kemikari yemvura-yakavakirwa kuchenesa mune inogara tembiricha yekugezera.
Isu tinosarudza yakanyatsokodzera PCBA yekuchenesa nzira zvinoenderana nePCBA zvinodiwa.