Tšebeletso ea Kopano ea PCB e le 'ngoe
Selelekela sa tshebeletso
XINRUNDA e fana ka tšebeletso ea PCBA ka phano e laolehang, e tšehetsoang ke tšebelisano e kopanetsoeng ea R & D ea rona e koetlisitsoeng hantle le e nang le phihlelo, boleng, theko, le sehlopha sa tsamaiso ea morero.Re na le boiphihlelo ba lilemo tse 19 indastering mme taolo e tiileng ea boleng e sebelisoa ke rona ho hlahisa lihlahisoa tse tšepahalang, re boetse re netefalitsoe ho ISO9001:2015, ISO14001:2015, ISO45001:2018, ISO13485:2016, le IATF16949:2016.
Bokhoni ba ho etsa tlhahiso ba holileng bo kenyelletsa dijithale, tlhahiso e ikemetseng ho fihlela litlhoko tsa bareki.Mochine oa SMT o hlahisa lintlha tse limilione tse 4 ka letsatsi, 'me COB e hlahisa mela e limilione tse 1.5 ka letsatsi.Aluminium substrate, ceramic board, FPC, le PCB tse ling li ka kenngoa, 'me likarolo tse fapaneng tsa sephutheloana tse kang CSP BGA QFN module e nang le molumo o motle oa 0.25mm le tsona li ka kenngoa ho PCB.
Bokhoni ba Tlhahiso
| Mochini oa SMT | |
| Matla a Letsatsi le Letsatsi | Lintlha tse limilione tse 4 (likotoana) / letsatsi |
| Patch Range | 0201-4540CHIP SET, likarolo tse sa tšoaneng tse bōpehileng, mefuta eohle ea IC (QFN/QFB/SOP/BGA/CSP/PLCC/etc.≥0.40MM) |
| Sekhahla sa Litšoaneleho | ≥ 99% |
| BONANG | |
| Matla a Letsatsi le Letsatsi | Mehala ea limilione tse 1.5 ka letsatsi |
| Welding bophara | 20-50.4UM (0.8-2.0MIL) mohala oa aluminium. |
| Boemo ba ho cheselletsa | +15.3UM -15.3UM (+0.6UM -0.6UM) |
| X, Y Ho Nepaha | 0.625 UML (0.0246MIL) |
| Ho nepahala ha Workbench | 0.0036 likhato |
| Sekhahla sa Litšoaneleho | ≥99% |
Lihlahisoa / Litšebeletso
● Mehlala e Mebeli ea Khoebo: High Mix High Volume, High Mix Low Volume
● PCBA E E Sebediswa Mekhahlelong e Mengata
● Flexible Customization
● Mokhoa oa ho Etsa Teko: Tlhahlobo ea Pono, Tlhahlobo ea X-ray, AOI (Automated Optical Inspection), ICT (In-Circuit Test) , Teko ea ho sebetsa.
● Tsamaiso ea Tsamaiso ea Ts'ebeletso: Lean Production System, MOM, le ERP.
● One-Stop Solution:
SMT, PTH (Pin through the Hole) , COB, Coating, Programming, ICT/FCT, Chemical/DI Ho hlatsoa metsi, Kopano le mohaho oa Mabokose
● Fana ka Litšebeletso tse Latelang:
Moralo oa Sehlahisoa, Nts'etsopele ea Boenjineri, Theko ea Likarolo le Taolo ea Lintho, Tlhahiso ea Lean, Teko, le Tsamaiso ea Boleng.
Ke Hobane'ng ha Rōna?
● Boiphihlelo bo batsi: lilemo tse 19 tsa phihlelo ea indasteri, liteko tse matla, le boleng bo tiisitsoeng.
● Nako e Khutšoanyane ea Ketapele, Karabelo e Potlakileng, le Kapele-pele ka Mor'a Thekiso.
● Lihlopha tsa Litsebi: R & D, Quality, Procurement, Project Management.
Lintlha tsa Motheo
| Mofuta oa Sehlahisoa | Kopano ea PCB |
| Mobala oa Mask oa Solder | Botala, Boputsoa, Bosoeu, Botsho, Bosehla, Bokhubelu, joalo-joalo |
| Mekhoa ea Kopano | SMT, DIP, Pin through Hole |
| Mehlala ea matha | E fumaneha |
| Tlhaloso | Customized |
| Boholo ba PCB | 410mm * 360mm |
| Mefuta ea PCB | Aluminium base PCBs, Ceramic PCBs, Flexible Printed Circuit, joalo-joalo. |
