1. I-SMT solder paste ichaphazela njani umgangatho we-soldering?
Ubungakanani be-flux mass ratio kunye nokwakhiwa kwezinto ze-solder paste flux:
(1) Izinto ezenza ifilimu: 2% ~ 5%, ikakhulukazi i-rosin, kunye ne-derivatives, izinto zokwenziwa, eyona nto isetyenziswa ngokuqhelekileyo yi-rosin emhlophe yamanzi.
(2) I-Activator: 0.05% ~ 0.5%, ii-activators ezisetyenziswa ngokuqhelekileyo ziquka i-dicarboxylic acids, i-carboxylic acids ekhethekileyo, kunye ne-organic halide salts.
(3) i-arhente Thixotropic: 0.2% ~ 2%, yandisa i-viscosity kwaye yenza njengokunqunyanyiswa. Zininzi izinto ezinjalo, ngokukhethekileyo ioli ye-castor, ioli ye-hydrogenated castor, i-ethylene glycol mono butylene, kunye ne-carboxymethyl cellulose.
(4) I-solvent: 3% ~ 7%, i-multi-component, eneendawo ezahlukeneyo zokubilisa.
(5) Abanye: ii-surfactants, ii-agent ezidibanisayo.
Impembelelo yokwakheka kwe-solder paste flux kumgangatho we-solder:
I-Tin bead splash, i-flux splash, uluhlu lweencwadi zebhola (i-BGA) i-void, i-bridging, kunye nokunye okungahambi kakuhle kokulungiswa kwetshiphu ye-SMT kunye nokuwelda kunobudlelwane obukhulu kunye nokwakhiwa kwe-solder paste. Ukukhethwa kwe-solder paste kufuneka kukhethwe ngokweempawu zenkqubo yendibano yebhodi yesekethe eprintiweyo (PCBA). Umlinganiselo we powder solder unempembelelo enkulu ekuphuculeni ukusebenza kwe-slump kunye ne-viscosity. Ukuphakama komxholo we-solder powder, incinci i-slump. Ngoko ke, i-solder paste esetyenziselwa amacandelo e-fine-pitch kufuneka isebenzise i-88% ~ 92% ngaphezulu komxholo we-solder powder we-solder paste.
1. I-activator inquma ukuthengiswa okanye ukumanzi kwe-solder paste. Ukufezekisa i-soldering efanelekileyo, kufuneka kubekho i-activator efanelekileyo kwi-solder paste, ngakumbi kwimeko ye-soldering ye-micro-pad, ukuba umsebenzi awunelanga, kunokubangela i-phenomenon yebhola yediliya kunye neziphene zebhola-socket.
2. Izinto ezenza ifilimu zichaphazela ukulinganiswa kwamalungu e-solder kunye ne-viscosity kunye ne-viscosity ye-solder paste.
3. I-Flux isetyenziselwa kakhulu ukunyibilikisa ii-activators, i-film-forming substances, i-thixotropic agents, njl njl. Iinjongo zokusebenzisa i-solvents ephezulu yokubilisa kukuthintela i-solder kunye ne-flux ekutshizeni ngexesha le-reflow soldering.
4. I-agent Thixotropic isetyenziselwa ukuphucula ukusebenza kokushicilela kunye nokusebenza kwenkqubo.
2. Ziziphi izinto ezichaphazela ukusebenza kakuhle kwemveliso ye-SMT?
Umjikelo wokubeka ubhekisela kwixesha elithathayo ukuba intloko yokubeka izixhobo iqale ukubala xa i-Feeder ithatha amacandelo, emva kokufunyanwa komfanekiso wamacandelo, i-cantilever ihambela kwindawo ehambelanayo, i-axis esebenzayo ibeka amacandelo kwibhodi ye-PCB, kwaye emva koko ibuyela kwi-Feeder feeder position. Ngumjikelo wokubekwa; ixesha elisetyenzisiweyo kumjikelo wokubekwa lilelona xabiso lisisiseko separameter echaphazela isantya somatshini wokubeka. Umjikelo wokubekwa koomatshini bokubekwa kwe-cantilever ngesantya esiphezulu sokunyusa amacandelo okuxhathisa amandla ahlala ngaphakathi kwe-1.0s. Okwangoku, ukubekwa kwe-SMT Umjikelo wesona santya siphezulu se-cantilever mounter kwishishini lokulungisa i-chip malunga ne-0.5s; umjikelo wokunyuka kwe-ICs ezinkulu, ii-BGA, izihlanganisi, kunye ne-aluminium electrolytic capacitors malunga ne-2s.
Izinto ezichaphazela umjikelo wokubekwa:
Izinga longqamaniso lokuchola amacandelo (oko kukuthi, iintonga ezininzi zokunxibelelana kwentloko yokubeka ziyenyuka kwaye ziwe ngaxeshanye ukuze zithathe amacandelo).
Ubungakanani bebhodi yePCB (eyona inkulu ibhodi yePCB, inkulu uluhlu lwentshukumo lwe-X/Y lwentloko yokubeka, kunye nexesha elide lokusebenza).
Ireyithi yokuphosa icandelo (ukuba iiparamitha zomfanekiso wecandelo azimiselwanga ngokufanelekileyo, ukujulwa kwezixhobo kunye nezenzo ze-X/Y ezingasebenziyo ziya kwenzeka ngexesha lenkqubo yokuqaphela umfanekiso wamacandelo okufunxa).
Isixhobo siseta ixabiso lepharamitha yesantya esihambayo X/Y/Z/R.
3. Indlela yokugcina ngokufanelekileyo kunye nokusebenzisa i-solder paste kwi-SMT patch processing factory?
1. Xa i-solder paste ingasetyenziswanga, kufuneka igcinwe efrijini, kwaye ukushisa kwayo kufuneka kube phakathi kwe-3 ~ 7 ° C. Nceda uqaphele ukuba intlama ye-solder ayinakukhenkcezwa ngaphantsi kwe-0°C.
2. Kufuneka kubekho i-thermometer ezinikeleyo kwifriji ukuze ibone ukushisa okugcinwe rhoqo kwiiyure ze-12 kwaye wenze irekhodi. I-thermometer kufuneka ihlolwe rhoqo ukukhusela ukungaphumeleli, kwaye iirekhodi ezifanelekileyo kufuneka zenziwe.
3. Xa kuthengwa i-solder paste, kuyimfuneko ukunamathisela umhla wokuthenga ukwahlula iibhetshi ezahlukeneyo. Ngokomyalelo wokulungiswa kwe-chip ye-SMT, kuyimfuneko ukulawula umjikelezo wokusetyenziswa kwe-solder paste, kwaye uluhlu lwempahla lulawulwa ngokubanzi kwiintsuku ezingama-30.
4. Ukugcinwa kwe-solder paste kufuneka kugcinwe ngokwahlukileyo ngokweentlobo ezahlukeneyo, amanani ebhetshi, kunye nabavelisi abahlukeneyo. Emva kokuthenga i-solder paste, kufuneka igcinwe efrijini, kwaye umgaqo wokuqala wokuqala, okokuqala kufuneka ulandelwe.
4. Ziziphi izizathu ze-welding ebandayo kwi-PCBA processing
1. Iqondo lokushisa lokufudumeza liphantsi kakhulu okanye ixesha lokuhlala kwi-reflow soldering ukushisa lifutshane kakhulu, okubangelwa ukushisa okunganeleyo ngexesha lokuphinda kunye nokunyibilika okungagqibekanga komgubo wesinyithi.
2. Kwinqanaba lokupholisa, umoya opholileyo oqinileyo, okanye ukunyakaza kwebhanti yokuhambisa engalinganiyo kuphazamisa i-solder joints, kwaye ibonise iimilo ezingalinganiyo kumphezulu we-solder joints, ngakumbi kwiqondo lokushisa elingaphantsi kancinci kunendawo yokunyibilika, xa i-solder ithambile kakhulu.
3. Ungcoliseko lomphezulu kunye neepads ezijikelezileyo okanye iinkokeli zinokuthintela ukuguquguquka kwesakhono, okukhokelela ekungeneni kwakhona okungaphelelanga. Ngamanye amaxesha i-powder ye-solder enganyibilikiyo ingabonwa kumphezulu we-solder joint. Ngexesha elifanayo, ukungonelanga kwe-flux umthamo kuya kubangela ukukhutshwa okungaphelelanga kwee-oxides zetsimbi kunye ne-condensation engaphelelanga elandelayo.
4. Umgangatho we-solder metal powder awulungile; uninzi lwazo lwenziwa yi-encapsulation ye-powder oxidized kakhulu.
5. Indlela yokuCoca iNdibano yePCB ngeyona ndlela iKhuselekileyo neFanelekileyo
Ukucoca iindibano ze-PCB kufuneka zisebenzise eyona nto ifanelekileyo yokucoca kunye ne-solvent yokucoca, exhomekeke kwiimfuno zebhodi. Apha, iindlela ezahlukeneyo zokucoca iPCB kunye nezinto eziluncedo nezibi zazo zibonisiwe.
1. Ultrasonic PCB Cleaning
Umcoci we-PCB we-ultrasonic ucoca ii-PCB ezingenanto ngokukhawuleza ngaphandle kokucoca i-solvent, kwaye le yeyona ndlela yokucoca i-PCB eyongayo. Ngaphandle koko, le ndlela yokucoca ayithinteli ubungakanani bePCB okanye ubungakanani. Nangona kunjalo, ayinakucoca indibano yePCB kuba i-ultrasonic inokwenzakalisa amacandelo e-elektroniki kunye nendibano. Kananjalo ayikwazi ukucoca i-aerospace / i-PCB yokukhusela kuba i-ultrasonic inokuchaphazela ukuchaneka kombane webhodi.
2. Ucoceko olupheleleyo oluzenzekelayo kwi-PCBA kwi-Intanethi
Isicoci esipheleleyo sePCBA esizenzekelayo kwi-intanethi sifanelekile ukucoca imiqulu emikhulu yendibano yePCB. Zombini i-PCB kunye ne-PCBA zinokucocwa, kwaye aziyi kuchaphazela ukuchaneka kweebhodi. I-PCBAs idlula i-cavities egcwele i-solvent ukuze igqibe iinkqubo zokucocwa kwamanzi amachiza, ukuhlanjululwa kwamanzi, ukomisa, njalo njalo. Le ndlela yokucoca i-PCBA ifuna i-solvent ukuba ihambelane namacandelo, i-PCB surface, i-solder mask, njl. Kwaye kufuneka sinikele ingqalelo kumacandelo akhethekileyo xa bengenakuhlanjwa. I-aerospace kunye ne-PCB yodidi lwezonyango inokucocwa ngolu hlobo.
3. Isiqingatha Automatic PCBA Cleaning
Ngokungafaniyo nesicoci sePCBA esikwi-intanethi, isicoci esizenzekelayo esinesiqingatha sinokuthuthwa ngesandla kuyo nayiphi na indawo yomgca wendibano, kwaye inomgodi omnye kuphela. Nangona iinkqubo zayo zokucoca zifana nokucocwa kwePCBA ekwi-intanethi, zonke iinkqubo zenzeka kumngxunya omnye. Ii-PCBAs kufuneka zilungiswe yi-fixture okanye zifakwe kwi-basket, kwaye ubuninzi bazo bulinganiselwe.
4. Ukucocwa kwePCBA yeManuwali
Isicoci sePCBA semanuwali sifanelekile kwibhetshi encinci yePCBA efuna isinyibilikisi sokucoca iMPC. I-PCBA igqibezela ukucocwa kwamanzi amachiza asekelwe kwimichiza kwindawo yokuhlambela yokushisa rhoqo.
Sikhetha eyona ndlela ifanelekileyo yokucoca iPCBA ngokuxhomekeke kwiimfuno zePCBA.